Please join Synopsys TCAD for an evening reception during IEDM 2019!
In June 2014 we released the latest version of CATS: J-2014.06. In this issue, we discuss the features and benefits of the new release.
Advanced multi-dimensional (1D/2D/3D) device simulator
Silicon Manufacturing Down to 5nm & Below
Oct 20, 2016 - Technology resurges as industry pushes to 7nm and 5nm.
Sep 14, 2017 - Focus is on cutting costs across the board, and it turns out there is still quite a bit to cut.
Feb 1, 2019 - DTCO can be aptly described as a software-based methodology for developing new semiconductor process nodes with a holistic consideration of how technology elements impact circuit ...
Apr 5, 2019 - In the context of DTCO, new interconnect metals not only offer the promise of reduced parasitic loading in the MOL but also enable the integration of new scaling boosters such as ...
9th Symposium on Two-dimensional Materials
European Congress and Exhibition on Advanced Materials and Process